Researchers will explore advanced memory systems and design approaches for microelectronic devices, the building blocks of modern computing, as part of two new microelectronics studies managed by the U.S. Department of Energy’s (DOE) Argonne National Laboratory.
Supratik Guha, who holds joint appointments as professor in the UChicago Pritzker School of Molecular Engineering and scientist at Argonne Physical Sciences and Engineering, will lead one of the projects, “Ultra Dense Memory: Atom Scale Material Dynamics and Systems Consequences.” The University of Chicago, Purdue University, the Georgia Institute of Technology, and Chicago State University are academic partners, and IBM and Micron Technologies are industrial collaborators.
The project will focus on future generations of extreme-scale memories — architectures and technologies designed to handle massive amounts of data at exceptionally high speeds, needed for tomorrow’s high-performance computers and sensors — and their synthesis for on-chip and off-chip applications. This project is part of DOE’s Extreme Lithography & Materials Innovation Center.
Argonne is a premier research institution in microelectronics, the tiny devices that power and control computers, smartphones, electric vehicles, and other information processing equipment and leads the projects as part of DOE’s Microelectronics Science Research Centers.
In December 2024, DOE’s Office of Science announced $160 million in funding to establish the research centers, which are being implemented through the historic CHIPS and Science Act of 2022. The centers will focus on microelectronics technologies for computing, communication, sensing, and power. Researchers in the microelectronics field seek transformative advances in energy efficiency and/or resilience in extreme environments.
—Article was adapted from a release originally published on Newswise