Chicago Future Manufacturing Seminar Series

Micro and Nanoscale Additive Manufacturing for Electronics Packaging Applications

The Nanoscale Design and Manufacturing Laboratory (NDML) at the University of Texas at Austin focuses on the design and development of novel processes and equipment for the manufacturing of micro and nanoscale devices and structures. This talk will focus on two new microscale additive manufacturing processes, known as Holographic Metasurface Nano Lithography (HMNL) and Microscale Selective Laser Sintering (μ-SLS), that has been developed in the NDML for the fabrication of 3D electronic interconnect structures. In the HMNL process, sub-wavelength-patterned metasurface masks (metamasks) are used to create multi-colored holograms in a photocurable metal-polymer hybrid resin. This process allows entire 3D, multi-material (insulators and conductors) nanostructures to be patterned using a single light exposure. Preliminary volumetric patterning using this method shows a build rate of over 20 mm3/s in both metals and polymers with sub-micron resolution making it ideal for fabricating redistribution layers for chip packaging applications. In the μ-SLS process, a thin layer of nanoparticle ink is first spread onto the substrate. The substrate is then positioned under an optical subsystem using a custom-built nanopositioning device. A laser that has been focused off a micromirror array is then used to sinter the nanoparticles together in a desired pattern with micrometer resolution. Another layer is then coated onto the substrate and the process is repeated to build up the 3D structure. Finally, the unsintered nanoparticles are washed away to reveal the final 3D part which is well suited for making microelectronic bump structures. This talk will present the materials science, mechatronic systems, optics designs, and process modeling used in both processes to make these additive manufacturing process capable of achieving micrometer resolution with high throughput over large areas (~ 50 mm x 50 mm) and thus break the conventional tradeoff between resolution and throughput in microscale metal 3D printing.

Meeting ID: 943 2939 5316 

Passcode: 075671

https://uchicago.zoom.us/j/94329395316?pwd=plFzNaQPaABagUsdeA1ukMDNki6Xmc.1